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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
  • name
  • name
  • name

High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

MOQ: 1 set/sets
Price: Negotiable
Delivery Period: 5-8 days
Payment Method: T/T, Western Union, Paypal, Credit card
Supply Capacity: 5000
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
WZ
Model Number
WZ-GX01
Product Name:
Die Bonding Machine
Solid Crystal Cycle:
>40 Ms
Dispensing Heating:
Constant Temperature
Resolution:
0.5 Um
Fetching Pressure:
20-200g
Power:
1.3 KW
Weight:
1040
Dimension(L*W*H):
1545*1080*1715 Mm
Highlight:

High Precision Semiconductor Packaging Equipment

,

LED Die Bonder Die Bonding Machine

Product Description

Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder

 

Product name die bonding machine
Solid crystal cycle >40 ms
Die bonding position accuracy ±0.3 mil
Dispensing heating constant temperature
Resolution 0.5 um
Chip ring size 6 inch
Image identification 256 gray scale
Fetching pressure 20-200 g
Frequency 50 HZ
Dimension(L*W*H) 1545*1080*1715 mm
Weight 1040
Voltage 220 V
Power 1.3 KW

 

Wafer Stage System
The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y
platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with
servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.
 
Feeding and Receiving System
The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the
precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked
according to actual needs, and the left and right material boxes can be quickly switched.

 

Imaging system
The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel
and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and
the Z-axis adjustment platform controls the focal length adjustment.
 
Swing arm system
The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the
swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation
and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and
stability.
 
Operating system
It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth
operation, which is in line with the operation habits of Chinese people.

 

High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine 0High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine 1High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine 2

 

Tags: 

PANASERT MSR feeder trolley,  

SS 2 tiers feeder trolley,  

800mm length smt machines

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products
PRODUCTS DETAILS
Products

SMT Pick And Place Machine

Samsung Pick and Place Machine

Fuji Pick and Place Machine

Juki Pick and Place Machine

SMT Reflow Oven

SMT AOI Machine

SMT Line Equipment

Solder Wave Machine

SMT Stencil Printer

SMT Feeder

SMT Nozzle

SMT Inspection Machine

PCB Loader Unloader

PCB Conveyor

SMT DIP Machine

SMT Parts
High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
  • name
  • name
  • name
High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
MOQ: 1 set/sets
Price: Negotiable
Delivery Period: 5-8 days
Payment Method: T/T, Western Union, Paypal, Credit card
Supply Capacity: 5000
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
WZ
Model Number
WZ-GX01
Product Name:
Die Bonding Machine
Solid Crystal Cycle:
>40 Ms
Dispensing Heating:
Constant Temperature
Resolution:
0.5 Um
Fetching Pressure:
20-200g
Power:
1.3 KW
Weight:
1040
Dimension(L*W*H):
1545*1080*1715 Mm
Minimum Order Quantity:
1 set/sets
Price:
Negotiable
Delivery Time:
5-8 days
Payment Terms:
T/T, Western Union, Paypal, Credit card
Supply Ability:
5000
Highlight

High Precision Semiconductor Packaging Equipment

,

LED Die Bonder Die Bonding Machine

Product Description

Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder

 

Product name die bonding machine
Solid crystal cycle >40 ms
Die bonding position accuracy ±0.3 mil
Dispensing heating constant temperature
Resolution 0.5 um
Chip ring size 6 inch
Image identification 256 gray scale
Fetching pressure 20-200 g
Frequency 50 HZ
Dimension(L*W*H) 1545*1080*1715 mm
Weight 1040
Voltage 220 V
Power 1.3 KW

 

Wafer Stage System
The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y
platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with
servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.
 
Feeding and Receiving System
The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the
precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked
according to actual needs, and the left and right material boxes can be quickly switched.

 

Imaging system
The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel
and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and
the Z-axis adjustment platform controls the focal length adjustment.
 
Swing arm system
The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the
swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation
and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and
stability.
 
Operating system
It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth
operation, which is in line with the operation habits of Chinese people.

 

High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine 0High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine 1High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine 2

 

Tags: 

PANASERT MSR feeder trolley,

SS 2 tiers feeder trolley,

800mm length smt machines

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