SMT placement machines Current status and future insights
2025-08-21
1. SMT Chip Mounting Machines—The Behind-the-Scenes Heroes of Electronics Manufacturing
In today's world, where electronic products permeate every corner of our lives, from mobile phones and computers to smart home devices, all rely on the support of electronic manufacturing technology. SMT chip mounters, as core equipment in the electronics manufacturing field, silently play a critical role behind the scenes and can be considered the behind-the-scenes heroes of electronics manufacturing.
SMT, or surface mount technology, is an advanced technique for directly attaching electronic components to the surface of printed circuit boards (PCBs). Compared to traditional plug-in assembly techniques, SMT offers many significant advantages, including high assembly density, smaller and lighter electronic products, higher reliability, and ease of automation. In SMT production lines, chip mounters are tasked with precisely and quickly placing tiny electronic components on designated locations on PCBs. Their accuracy, speed, and stability directly determine the performance, quality, and production efficiency of electronic products. It's no exaggeration to say that SMT chip mounters are the "heart" of modern electronics manufacturing, driving the continuous development of the entire industry.
With the rapid advancement of technology and the continuous evolution of market demands, SMT placement machines are also keeping pace with the times, demonstrating a series of remarkable development trends. Let's delve deeper into these trends and uncover the mystery of the future development of SMT placement machines.
2. Current Landscape: SMT Placement Machine Development Status
I) Market Size and Growth Trends
In recent years, the global SMT placement machine market has shown steady growth. According to relevant market research reports, the global SMT placement machine market reached US$ [X] billion in [specific year] and is expected to exceed US$ [X] billion by [forecast year], with a compound annual growth rate of approximately [X]%. Growth momentum is even stronger in the Chinese market, where the SMT placement machine market reached RMB [X] billion in [specific year] and is expected to maintain a high growth rate.
This growth trend is driven by a combination of factors. The booming consumer electronics sector is a major driving force. The continuous introduction of new products such as smartphones, tablets, and smart wearables, coupled with strong market demand, has prompted electronics manufacturers to increase production line investment, leading to a corresponding increase in purchases of SMT placement machines. Take smartphones, for example. Their increasingly powerful features and increasingly sophisticated electronic components place higher demands on the high-precision, high-speed placement capabilities of SMT placement machines, driving a boom in the high-end SMT machine market.
On the other hand, the rise of industries such as automotive electronics, industrial control, and medical equipment has opened up new growth paths for SMT placement machines. In the automotive sector, the rapid adoption of new energy vehicles has led to increasingly complex onboard electronic systems. From power control and battery management to intelligent driver assistance systems, these systems require the placement of a large number of high-precision electronic components, creating a broad application space for SMT placement machines. The advancement of Industry 4.0 and smart manufacturing has significantly increased demand for products such as industrial automation equipment and smart sensors. The circuit boards used in these devices also rely on advanced SMT placement machine technology. The medical equipment industry, such as portable medical monitoring instruments and high-end diagnostic imaging equipment, is also absorbing the advanced production capacity of SMT placement machines due to its pursuit of product reliability and miniaturization.
Furthermore, the large-scale commercialization of 5G communication technology has driven explosive growth in related products such as base station equipment and 5G mobile phones, further stimulating the SMT placement machine market. 5G products have stringent requirements for high-frequency and high-speed signal transmission, requiring the use of more sophisticated electronic components and requiring even higher standards of placement accuracy. This has led electronics manufacturers to upgrade their placement machine equipment to meet the production demands of the 5G era.
2. Technical Level and Application Areas
Currently, the technological level of SMT placement machines has reached a remarkably high level. In terms of precision, high-end placement machines can maintain placement accuracy within ±[X]μm. Some advanced models even achieve even higher precision, sufficient to precisely place tiny components such as 01005 and 0201. This is crucial for the manufacture of high-density circuit boards in consumer electronics. For example, the densely packed chips, resistors, capacitors, and other components on mobile phone motherboards require high-precision placement machines to ensure they are accurately positioned in their designated locations, thus ensuring stable and reliable product performance.
Speed is also a key indicator of placement machine performance. Today, high-speed placement machines can achieve placement speeds exceeding [X] million pieces per hour. Some top-tier models achieve even more impressive placement speeds after optimizing production processes and improving motion control efficiency. For example, in the mass production of consumer electronics products such as smartphones and tablets, high-speed placement machines can significantly shorten production cycles, increase production capacity and market responsiveness, and meet consumer demand for rapid electronic product upgrades. In addition to high-precision and high-speed placement, SMT placement machines have also made significant progress in intelligent and flexible production. This intelligence is reflected in their ability to automatically identify component type, size, and shape, optimizing placement paths through built-in intelligent algorithms to reduce placement time and material loss. Furthermore, they feature real-time monitoring capabilities, precisely monitoring parameters such as pressure, position, and angle during the placement process. Upon detecting deviations or anomalies, automatic adjustments or alarms are immediately issued, effectively ensuring consistent placement quality. Flexibility enables placement machines to quickly adapt to the production needs of different products and batches. Convenient programming and quick line changeover technology allow for easy switching between production tasks, enabling efficient production of small batches of diverse products. This is particularly critical in the current market environment where demand for personalized, customized electronic products is growing.
SMT placement machines have long been widely used across various electronics manufacturing industries. Consumer electronics is undoubtedly its largest application area. From everyday mobile phones, computers, and tablets to smart home devices, smart speakers, and video game consoles, SMT placement machines are core equipment for assembling the electronic circuit boards within these devices. Take mobile phone production as an example. A smartphone typically contains hundreds or even thousands of electronic components, ranging from tiny chip resistors and capacitors to complex chip modules. These components require SMT placement machines to accurately and quickly place them, ensuring the phone's lightweight, portable, powerful, and feature-rich features.
The automotive electronics sector is also a key market for SMT placement machines. With the increasing intelligence and electrification of vehicles, the proportion of automotive electronic systems within the vehicle is increasing. Circuit boards in key components such as engine control units (ECUs), in-vehicle infotainment systems (IVIs), and automated driver assistance systems (ADASs) all rely on SMT placement machines for component placement. These automotive electronics products demand extremely high reliability and stability, as they directly impact driving safety. Therefore, SMT placement machines are crucial for ensuring precision and quality control in automotive electronics production.
Industrial automation is also indispensable. Various industrial controllers, sensors, inverters, PLCs, and other equipment contain complex circuit boards that must support high-precision, high-stability electronic components to ensure long-term reliable operation in complex and harsh production environments. SMT placement machines, with their superior placement technology, provide solid hardware support for the development of the industrial automation industry.
Furthermore, medical electronics, aerospace, communications equipment, and other fields are also areas where SMT placement machines are making a significant impact. In medical electronic equipment such as pacemakers, blood glucose meters, and ultrasound diagnostic equipment, high-precision and high-reliability SMT placement processes can ensure the accurate operation of medical equipment and safeguard the lives and health of patients. In the aerospace field, electronic equipment in satellites, spacecraft, and aircraft has extremely high requirements for component reliability and radiation resistance. While meeting these stringent requirements, SMT placement machines help humans explore the universe. In the communications equipment industry, whether it is 5G base station equipment, optical communication modules, or server motherboards in large data centers, SMT placement machines play a key role in promoting the rapid development of global communication networks.
3. Chasing the Light: Development Trends in SMT Placement Machines
(I) High Performance: Advances in Speed, Precision, and Reliability
In the pursuit of superior performance, SMT placement machines are constantly pushing boundaries. Take Apple mobile phone production as an example. The A-series chips installed on their motherboards have extremely fine pin pitch, placing extremely high demands on placement accuracy. To meet this demand, placement machine manufacturers have invested significant R&D resources in optimizing placement head design. High-precision linear motors drive the placement heads, achieving several times greater precision than traditional rotary motors, enabling submicron-level positioning. Furthermore, high-resolution visual recognition systems utilize advanced image processing algorithms for rapid and accurate identification and alignment of chip pins, ensuring that every chip is accurately and precisely placed on the motherboard. This effectively reduces product defects caused by placement errors and safeguards the superior performance and quality of Apple mobile phones.
In the automotive electronics sector, engine control units (ECUs) have stringent reliability requirements. The placement machine strengthens its mechanical structure design and uses high-strength, low-expansion coefficient materials to manufacture its body frame, effectively reducing the vibration and thermal deformation of the equipment during long-term high-speed operation, ensuring the stability of placement accuracy. At the same time, a redundant design concept is introduced, and key motion control systems, feeding systems, etc. are equipped with backup modules. Once the main module fails, the backup module can be quickly and seamlessly switched to ensure production continuity, making the placement yield of automotive electronic components as high as over 99.9%, providing a solid guarantee for the stable operation of the vehicle.
(II) High Efficiency: Multi-cantilever and Dual-Line Conveyor Become the Mainstream
Traditional single-cantilever placement machines are increasingly struggling to meet the demands of large-scale production. However, multi-cantilever placement machines are now emerging. For example, a high-end mobile phone production line at Samsung Electronics utilizes a quad-cantilever placement machine that can handle exponentially more placement tasks in the same amount of time compared to a traditional single-cantilever placement machine. The four cantilevers work in tandem, allowing one cantilever to pick up components while the others simultaneously perform placement operations. This significantly shortens the placement cycle for a single PCB, increasing production line capacity by 3-4 times and effectively ensuring sufficient supply of Samsung mobile phones to the global market.
Dual-line conveyor technology has also made significant contributions to efficiency improvements. Dual-line conveyor placement machines play a key role in Huawei's 5G base station equipment production line. These placement machines utilize a synchronized operation, allowing them to simultaneously place two large PCBs of the same specifications. When assembling 5G base station main control boards, the dual-channel conveyor design significantly reduces the ineffective waiting time of the placement machine, increasing the overall equipment utilization rate by nearly 50%, greatly shortening the production cycle of 5G base station equipment, and providing strong support for Huawei's rapid layout in the global 5G market.
(III) High Integration: Multifunctional Integration
In the consumer electronics sector, smart wearable devices strive for extreme lightness, thinness, and compactness. Chip placement machines with integrated dispensing capabilities can precisely control the amount and placement of glue while placing tiny chips, completing processes such as chip underfill. This ensures chip stability in complex operating environments and effectively improves product reliability. Integrated detection capabilities monitor placement quality in real time. Immediately detect problems such as offset or missing parts, triggering alerts and corrections to prevent defective products from being passed to the next process. This increases the first-time yield of smart wearable devices to over 98%, facilitating rapid market launch.
The convergence of semiconductor packaging and SMT is becoming increasingly prominent. In TSMC's advanced semiconductor packaging production lines, chip placement machines not only perform traditional SMT placement tasks but also offer wafer-level packaging (WLP) capabilities. Using a specially designed placement head and a high-precision vacuum suction system, tiny chips can be directly placed on wafers, achieving high-density chip integration. Furthermore, advanced bonding processes ensure stable and reliable electrical connections between the chip and wafer, providing critical support for the mass production of high-performance semiconductor chips and meeting the ultimate pursuit of chip performance in fields such as artificial intelligence and high-performance computing.
(IV) Flexibility: Flexible Adaptation to Diverse Production Needs
The modular design makes placement machines like transformers, easily adapting to diverse production tasks. Foxconn, one of the world's largest electronics manufacturing service providers, widely uses modular placement machines in its factories. To meet diverse electronic product orders from clients such as Apple, HP, Foxconn can quickly switch production from mobile phone motherboards to computer motherboards, from high-end server circuit boards to small consumer electronics boards, simply by quickly replacing the corresponding placement head modules and feeder modules. For example, replacing a high-speed placement head module with a high-precision one can meet the placement requirements of complex chips on server motherboards. Adjusting the feeder module to accommodate components of varying specifications allows a single production line to quickly switch between dozens of different products, significantly improving production flexibility and equipment utilization.
Improving material compatibility is also crucial. On the production lines of Xiaomi's ecosystem companies, placement machines are compatible with thousands of materials of varying specifications, ranging from tiny 01005 resistors and capacitors to large BGA packaged chips. An intelligent recognition system automatically identifies material size, shape, and pin type, and automatically adjusts placement parameters to ensure precise placement of each material. Whether it's Xiaomi mobile phones, wristbands, or circuit boards for smart home devices, the same placement machine can efficiently place and place them, meeting Xiaomi's diverse product needs and rapidly iterating production requirements.
(V) Intelligence: AI Empowerment, Autonomous Error Correction
The in-depth application of machine learning and artificial intelligence technologies has given chip placement machines an "intelligent brain." In the production process of Lenovo computer motherboards, chip placement machines use machine learning algorithms to analyze large amounts of past placement data. These machines can intelligently predict potential component placement issues, such as a batch of resistors with increased placement defect rates due to lead oxidation, and proactively provide optimization solutions. During actual placement, if an anomaly is detected, the chip placement machine quickly adjusts placement parameters such as pressure and angle based on the intelligent algorithm, automatically correcting any deviations. This has reduced the motherboard placement defect rate by over 30%, ensuring the high-quality production of Lenovo computers.
Big data analysis technology facilitates production optimization. In Bosch Automotive Electronics' production workshops, chip placement machines collect and upload every placement data to a cloud-based big data platform. By deeply mining this massive amount of data, engineers gain a clear understanding of equipment operating conditions, production efficiency, product quality trends, and other information. For example, a production line was found to have slight fluctuations in placement accuracy within a specific time period. Big data analysis pinpointed this as a result of ambient temperature fluctuations affecting the precision of the placement head. Consequently, prompt measures were taken, such as adjusting the workshop temperature and optimizing the placement head calibration process, to ensure the stability of the production process and the consistency of product quality, effectively improving the reliability and market competitiveness of Bosch's automotive electronics products.
(VI) Greening: Environmental protection is a key focus throughout.
Apple has consistently promoted green development within its supply chain, and its contract manufacturers have achieved significant success in managing the energy consumption of their SMT placement machines. By employing advanced variable frequency drive technology, placement machines intelligently adjust motor speed based on actual production load, eliminating the energy waste associated with traditional equipment operating at no load or low load. In the production of Apple iPads, the newer machines reduce unit energy consumption by approximately 25% compared to older models, saving significant annual electricity costs and contributing to Apple's goal of achieving carbon neutrality.
To reduce waste, Huawei's SMT production lines have introduced a closed-loop material management system. Chip placement machines, coupled with this system, precisely recycle and reuse solder paste and component waste from the production process. For example, recycled solder paste undergoes purification and can be reused in the circuit board soldering process. Component waste is then sorted and disassembled, with reusable parts returning to production. This has reduced waste emissions by nearly 40%, lowering both production costs and environmental pollution.
To improve the environmental friendliness of materials, many chip placement machine manufacturers are beginning to use recyclable materials in components such as equipment casings and conveyor belts. For example, Foxconn uses biodegradable plastics in some chip placement machines instead of traditional engineering plastics. These materials decompose quickly in the natural environment at the end of the equipment's lifespan, reducing the long-term harm of e-waste to soil and water resources and fulfilling its social responsibility for green environmental protection.
(VII) Diversification: Specific Customization, Leveraging Different Strengths
Customized chip placement machines have emerged to meet the specific needs of various industries. In the medical electronics sector, Mindray Medical's production of high-end medical devices places extremely high demands on chip placement machines. Customized chip placement machines feature ultra-clean working environments. Equipped with high-efficiency particulate air (HEPA) filters, they effectively filter out fine dust and microorganisms from the air, preventing them from contaminating the medical device's circuit boards. Furthermore, they strive for exceptional placement precision, enabling precise placement of critical components such as tiny biosensor chips. This ensures the accuracy and reliability of medical device test data, safeguarding patients' health.
For small and medium-sized enterprises, cost-effective, compact chip placement machines are a boon. For example, a startup specializing in smart speaker production, facing limited funds and a small production site, chose a small desktop chip placement machine. Despite its compact size, this machine offers comprehensive functionality, high-speed placement capabilities, and high precision, meeting the placement requirements of common components on smart speaker circuit boards. Furthermore, these devices are easy to operate and maintain, significantly reducing equipment procurement and operating costs for businesses and helping startups gain a foothold in the fiercely competitive market.
Amid the continuous emergence of new packaging formats, die bonders continue to evolve to adapt. With the gradual adoption of fan-out wafer-level packaging (FOWLP) technology in the semiconductor industry, die bonders are being optimized for the unique characteristics of this packaging format. Their specially designed flexible die bonding heads gently and precisely handle ultra-thin, ultra-large wafer-level packaged chips, ensuring they are not damaged during the bonding process. Furthermore, coupled with a high-precision vision alignment system, they precisely align the tiny fan-out pins on the chips, meeting the stringent packaging and bonding requirements of high-performance chips such as 5G and AI chips, driving technological advancement in the semiconductor industry.
4. Challenges Coexist: Thorns on the Road Ahead
Although the future of SMT placement machines is promising, the road ahead is not entirely smooth, and numerous challenges lie ahead.
From a technological innovation perspective, the continuous pursuit of higher precision, faster speed, and greater intelligence requires companies to invest massive amounts of R&D funds and manpower. For example, developing a next-generation high-precision visual recognition system not only requires overcoming challenges such as ultra-precision optical lens manufacturing and high-speed image processing algorithms, but also addresses complex issues such as system stability and compatibility. Exploring new motion control technologies to achieve submicron or even nanometer-level precision positioning of placement heads places extremely high demands on the interdisciplinary integration of mechanical design, materials science, and control theory. For smaller, less powerful small and medium-sized enterprises, such massive R&D investments are undoubtedly a heavy burden, potentially leaving them behind in the wave of technological advancement.
Cost control is also a significant challenge. On the one hand, high-end components such as high-precision lead screws, high-performance motors, and advanced sensors rely heavily on imports. These components are not only expensive to procure but also face the risk of unstable supply and supply disruptions due to trade frictions, keeping the overall cost of placement machines high. Furthermore, with rising labor costs, companies are spending more on production, commissioning, and maintenance, further squeezing profit margins. Failure to effectively control costs puts companies at a disadvantage in the market.
The intensity of market competition is unimaginable. Internationally renowned brands, leveraging their deep technical expertise, extensive brand influence, and comprehensive global sales and service networks, firmly dominate the high-end market and continue to erode market share in emerging markets. Meanwhile, many domestic companies are locked in fierce price wars in the mid- and low-end markets, resulting in severe product homogeneity and meager profits. For example, with dozens of products offering similar performance parameters on the market, some companies are willing to sell below cost to secure orders, leading to a decline in profitability across the industry and posing a severe challenge to sustainable development.
In the face of these challenges, SMT placement machine companies can only forge ahead in the future development wave and continue to write a glorious chapter in the field of electronic manufacturing by strengthening their determination to innovate, increasing R&D investment, and improving their independent innovation capabilities; optimizing supply chain management, reducing procurement costs, and strengthening cost control; deeply cultivating segmented markets, creating differentiated competitive advantages, and strengthening brand building.
5. The Future Has Arrived: Embracing the New Era of SMT Placement Machines
In summary, SMT placement machines are making great strides toward high performance, high efficiency, high integration, flexibility, intelligence, environmental friendliness, and diversification. These development trends are the inevitable result of technological advancement and market demand, and they also present unprecedented opportunities for the electronics manufacturing industry.
For us SMT engineers and practitioners, this is an era full of challenges and promise. We must keep pace with technological developments, continuously acquire new knowledge and skills, and enhance our professional competence to adapt to the increasingly intelligent and complex operation and maintenance requirements of placement machines. We must be innovative and actively participate in our company's technological R&D and process improvements, contributing to the rise of domestic placement machines. Furthermore, we must strengthen environmental awareness and incorporate green concepts into every aspect of production, thereby promoting the sustainable development of the electronics manufacturing industry.
We believe that in the near future, with the continued innovation of SMT placement machine technology, we will witness the electronics manufacturing industry reach even greater heights, bringing more powerful, lightweight, portable, and environmentally friendly electronic products to consumers around the world, allowing technology to better serve human life. Let us work together to welcome the arrival of a new era of SMT placement machines!
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What is an X-Ray Intelligent Counter
2025-08-14
An X-ray counter (also known as an X-ray counting machine) uses X-ray technology to automatically count electronic components. Its core principle is based on the differential absorption of X-rays by materials and intelligent image recognition technology. Its main operating principles include the following:
1. X-ray Generation and Penetration
Ray Generation: A high-voltage generator provides a high voltage to the X-ray tube, causing electrons emitted by the cathode filament to collide with the anode target (such as tungsten metal) at high speed, generating X-rays.
Material Penetration: X-rays penetrate the tray or strip containing electronic components. Materials of varying densities (such as metal pins and plastic packaging) absorb the X-rays to varying degrees, resulting in varying intensities after penetration.
2. Image Capture and Signal Conversion
Detector Reception: A flat-panel detector (or parallel-plate detector) captures the X-rays after penetration and generates a grayscale image based on the intensity differences (high-density areas appear dark, low-density areas appear bright).
Signal Digitization: The detector converts the optical image into an electrical signal, which is then transmitted to the image processing system. III. Intelligent Image Processing and Counting
Image Preprocessing: Optimizes image quality through noise reduction, contrast enhancement, and other technologies.
Feature Recognition:
Contour Extraction: Utilizes edge detection algorithms to identify component shape, size, and position.
Layer Analysis: Utilizes deep image processing algorithms to identify hidden components layer by layer in multi-layered trays.
AI-Assisted Counting: Combining pattern recognition and deep learning algorithms, it matches component database features for accurate classification and automatic counting.
IV. Result Output
Processed data is displayed in real time on the user interface, generating quantity reports that can be synchronized to production management systems (such as MES). Data export and report printing are supported.
Best Regard For You
Email ：wenzhanhucai@163.com
Wechat: 18823383970
Tel: +8618823383970
Website: www.smtwenzhan.com
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FUJI NXT M3III introduce
2025-08-07
The NXT machine is not limited to the conventional concept of a "chip mounter." Rather, it aims to create a completely new "new SMT production line system concept" in the era of reform and development, striving for total resolution. Adapting to variable production, the new system's chip mounter utilizes cutting-edge technology, creating a brand-new chip mounter that utilizes extensive sensor functions for placement reliability and quality control. The NXT machine is available in two types: the M3(S) and M6(S) modules, each with varying module widths. Designed with miniaturization and low cost in mind, this machine achieves space savings, high output, and a low price compared to previous models, significantly reducing production costs per unit of production.
The Fujifilm NXT M3III (4M III Base) SMT placement machine features a compact footprint, stable performance, and improved productivity. It supports 03015 components with a placement accuracy of ±25μm*. Its wide compatibility allows it to be equipped with various placement heads to meet customer production needs.
1. Placement Accuracy: Under optimal conditions, high-precision adjustment for rectangular chip placement achieves ±0.038 (±0.050) mm (3σ) cpk ≥ 1.00.
2. Placement Speed: Capacity reaches up to 25,000 CPH, and 24,000 CPH with the component presence check function enabled.
3. Applicable PCB Size: Dual-track sizes range from 48mm × 48mm to 534mm × 510mm.
4. Applicable Component Size: 0402 to 7.5 × 7.5mm, with a maximum height of 3.0mm.
Best Regard For You
Email ：wenzhanhucai@163.com
Wechat: 18823383970
Tel: +8618823383970
Website: www.smtwenzhan.com
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Introduction to different models of Yamaha SMT machines
2025-07-10
Yamaha SMT machines have a high reputation in the field of surface mount technology (SMT), known for their high precision and stability. Different models of Yamaha surface mount machines are suitable for various production needs. Below, we will provide a detailed introduction to the precision parameters of several mainstream models.
Yamaha YSM20R
The YSM20R is Yamaha's latest generation high-speed multifunctional pick-and-place machine, designed to enhance production efficiency while maintaining high precision. This model achieves a placement accuracy of ±15μm (Cpk≥1.0) and strikes a good balance between speed and accuracy. The YSM20R utilizes unique rotary drive technology, ensuring high stability and placement accuracy even during high-speed operation.
Yamaha YS12F
The YS12F is a high-speed universal pick-and-place machine designed for small to medium batch production. It offers a placement accuracy of ±30μm (Cpk≥1.0), suitable for the precise placement of various components. The YS12F is equipped with a high-precision flying camera and a fully automatic vision correction system, ensuring that placement accuracy is not compromised even under high-speed conditions.
Yamaha YSM10
The YSM10 is a compact high-speed pick-and-place machine primarily aimed at the production needs of high-density PCBs. This model has a placement accuracy of ±25μm (Cpk≥1.0), making it particularly suitable for small components and high-density assembly applications. The YSM10 features multiple camera systems and intelligent recognition technology, further enhancing the placement accuracy and speed of components.
Yamaha YS24X
The YS24X is an ultra-high-speed pick-and-place machine designed for large-scale production lines. Despite its extremely high placement speed, it maintains an accuracy of ±25μm (Cpk≥1.0). The YS24X employs advanced servo drive and vision correction technologies, significantly improving placement stability and accuracy while maintaining high speed.
Yamaha YSM40R
The YSM40R is Yamaha's flagship model designed for large-scale production, characterized by its ability to balance ultra-high speed and high precision. It achieves a placement accuracy of ±20μm (Cpk≥1.0) and can place over 200,000 components per hour. The YSM40R features a multi-head design that greatly enhances placement precision while ensuring speed.
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Working principle of dek 03ix printing machine
2025-07-03
Its core working principle includes three aspects: the visual positioning system captures MARK points on the PCB and steel mesh through up and down dual cameras, and achieves micrometer level alignment accuracy with high-speed lenses and independent light sources. The printing control system adopts a cantilever printing head design, and computer servo controls parameters such as pressure/speed/stroke of the scraper to ensure stable printing quality. The cleaning system has an automatic wiping function, including three modes of dry wiping/wet wiping/vacuum, and a programmable cleaning frequency of .
Other important information includes: the maximum processing size of the device is 510 × 508.5mm, with a repeatability accuracy of ± 25 μ m (6 σ standard), and it uses the Instinctiv V9 operating system. When answering, focus on highlighting these technical highlights and avoid excessive basic descriptions.
Considering that this is an industrial equipment description, we plan to use a structured presentation format, divided into two main parts: core systems and workflow. Insert thecomponent in the appropriate position to display the device structure diagram, and use thecomponent to supplement the technical parameter card. Although the search results for thecomponent mention videos with underlying principles, the specific link is not available, so we have decided not to insert the video component.
1、 Core system composition and functions
Visual positioning system
Dual view alignment: By independently controlling the up/down view optical lens, the MARK points on the PCB and steel mesh are captured at high speed to achieve precise alignment, with a repeat positioning accuracy of ± 25 microns (6 Sigma standard).
Light source adjustment: The independent lighting system can dynamically optimize lighting conditions to ensure image recognition stability. 13
Printing control system
Cantilever printing head: Designed with a high rigidity structure, the scraper pressure, speed, and stroke are all controlled by computer servo to ensure printing uniformity.
Scraper parameters: The metal scraper operates at an angle of 45 ° -60 °, with a pressure range of 3-15N/cm ² and a speed of 20-80mm/s, ensuring that the solder paste fully fills the steel mesh openings. 34
PCB processing device
Dynamic clamping system: The magnetic top pin and edge clamping device are adaptive to PCBs of different sizes/thicknesses (up to 510mm × 508.5mm), effectively overcoming circuit board deformation.
Supporting pins: prevent PCB bending during the printing process and maintain flatness. 34
Steel mesh cleaning system
Automated cleaning: Programmable selection of dry wipe, wet wipe, or vacuum adsorption modes to remove residual solder paste at the bottom of the steel mesh according to the set cycle, avoiding hole blockage
Detailed explanation of workflow
1. PCB positioning
The PCB enters the equipment through a conveyor belt, and the fixture automatically clamps and locates it. The visual system scans the MARK points and calibrates the position of the steel mesh and PCB.
2. Solder paste filling
The scraper moves horizontally to evenly press the solder paste into the steel mesh opening. The servo system adjusts the parameters of the scraper in real time to ensure that the opening filling rate is greater than 95%.
3. Demoulding and transfer printing
The steel mesh is separated from the PCB, and solder paste is precisely deposited on the solder pads. The demolding speed and spacing should match the viscosity of the solder paste to prevent pulling or bridging.
4. Cleaning and Quality Inspection
After completing multiple prints, the automatic wiping device cleans the bottom surface of the steel mesh; Some models integrate SPI (solder paste detector) linkage function to monitor printing quality in real-time
Key technological advantages
Precision control: Driven by high-precision servo motors, combined with the Instinctiv V9 operating interface, achieving a printing accuracy of ± 25 μ m.
Stability design: The lightweight structure of the cantilever scraper crossbeam reduces inertia, and the printing repeatability Cpk is greater than 2.0.
Intelligent diagnosis: The fault self checking system prompts abnormal causes (such as scraper pressure deviation, visual alignment failure, etc.) through sound and light alarms.
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